Detection Technology is proud to announce that the International Microelectronics and Packaging Society (IMAPS) has invited the company to IMAPS Nordic 2016 annual conference as a speaker. Material Specialist Sami Junnila from Detection Technology presents a paper discussing X-ray imaging sensors, materials and assembly trends at the session of sensor applications on June 7th.
The conference paper outlines the key sensor manufacturing process technologies, front-side illuminated (FSI) sensors assembled with the die attach and wire bonding process and backside-illuminated (BSI) sensors utilizing the flip-chip production technology. The presentation culminates to assembly trends, challenges and required new assembly materials in the future.
IMAPS is a non-profit society for companies and institutions involved in electronics packaging and production. The society is committed to the spreading of knowledge and information in its field. IMAPS Nordic annual conference 2016 will be held in Tønsberg, Norway on June 5-7.