High flexibility for volume and product mix changes, state-of-the-art production facilities with the latest testing capabilities. We have all needed for delivering high-quality solutions in volumes, just in time.
We have been manufacturing solutions for the most stringent applications over 25 years with the cumulative number of solutions shipped being over 4.8 million, and the number is growing rapidly.
We have had manufacturing operations in China for almost twenty years. Our volume production facility with class ISO 7 cleanroom and ESD controlled assembly area is located in Beijing. The new Beijing factory was ramped up in 2015, and it has boosted our quality and cost targets for greater customer value since then.
We have long traditions of manufacturing high-precision products also in Finland. Our facility in Oulu supports new product introduction (NPI) serving the needs of customers globally.
Cumulative number of solutions shipped
We operate the both manufacturing sites with the very same processes enabling seamless product transfers from the one site to another. Our production facilities are built with the highest level of flexibility for quick volume and product mix changes. We take care that our production capability and capacity evolve to meet the fast-paced demands of the marketplace.
‘Build-to-order’ production processes.
Highlights of key in-house processes
- Silicon wafer dicing
- Chip assembly (chip-on-board, flip chip) on organic and ceramic substrates
- Wire bonding
- Scintillator assembly
- Final assembly (PCBAs, cables, mechanics)
- Final electrical and optical testing