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Detector Component Products

High-Performance Diodes for Ionizing Radiation

High-Quality Photodiodes

High-Quality Standard and Customized Photodiode Arrays

Custom Detector Dies

Detector Module Products and Services

Silicon Radiation Detector Modules

X-Ray Linear Array Detectors

Customer-Specific Detector Modules

Microelectronics Testing,
Dicing and Packaging Services

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Microelectronics Testing, Dicing and Packaging Services

Detection Technology designs, manufactures, and markets unique, high performance silicon photodiodes, radiation detectors, sensor modules and their related electronics.

Based on wide experience in packaging of various microelectronics semiconductor sensor components, Detection Technology offers extensive line of prototyping and production services. Modern state-of-the-art cleanroom facilities and latest equipment provide fast, reliable and cost-effective high quality services. Detection Technology provides versatile wafer dicing, and package services. We can also take care of the entire microelectronic module manufacturing process from subcontracting the components to assembly and testing of the complete modules as shown in figure 1.


 


Figure 1.
Wafer level testing
• Semi-automatic and manual probing
• Probe card design
• Semiconductor parameter analysis

Ask more details for measurement facilities
Silicon wafer dicing
• Up to 6'' (150mm) wafers
• Minimum die size 1.5mm x 1.5mm
• Accuracy <+- 3um
• Wafer thicknesses up to 700um

Pick and placement into chip trays

Chip die and wire bonding
• Epoxy diebonding
• 25um Al-wire bonding

Hermetic sealing of packages
• Transistor device packages, TO
• Crystal device packages, HC
• DIL, LCC
• Other packages, please consult sales
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