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We are looking for a technical professional to join our Process Development team in Ii
Your reponsibilities include:
Developing component packaging technology (BGA and Flip Chip) for our next generation products
Further developing our current packaging technology (COB)
Researching and introducing new component packaging materials (substrates, epoxies) into our products
Participating in preparations and updating of component packaging roadmaps, and plans
Requirements:
M.Sc Eng. or higher
Minimum of 3-5 years of industrial experience in component assembly operation
Good communication skills in English
Energetic team player
Location in DT Headquarters Ii, Finland
You will be reporting to Director of Process Development.
We offer you a great opportunity to work in a worldwide operating high-tech company, having offices in Ii, Espoo, Beijing, Hong Kong and Cleveland, USA. As well as a challenging position as a member of an international team of specialists in Medical and Security Imaging fields and full support of our Process Development team.
For more information, please contact (daily until 12 am) Tero Ahola, Director
of Process Development, at +358 40 5063299, or Jyrki Still, Vice-President of
Engineering, at +358 40 5292764.
Applications and CV’s should be sent by February 8 to:
Detection Technology / Employment
Piisilta 1,
91100, Ii
FINLAND
Or, by e-mail: employment@deetee.com
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